PROPERTIES OF AL/CU BIMETALLIC PLATE PREPARED BY P/M TECHNIQUE: SINTERING TEMPERATURE EFFECT | ||
| JES. Journal of Engineering Sciences | ||
| Article 4, Volume 45, No 1, January and February 2017, Pages 45-59 PDF (953.25 K) | ||
| Document Type: Research Paper | ||
| DOI: 10.21608/jesaun.2017.116086 | ||
| Author | ||
| Moataz H. Ata | ||
| Department of Mechanical Engineering, Faculty of Industrial Education, Sohag University, 82524 Sohag, Egypt | ||
| Abstract | ||
| The goal of this work was to fabricate an aluminum/copper powder metallurgy bimetal plates at various sintering temperature ranging between 300oC and 600oC. Microstructure and properties for sintering specimens were performed to appreciate the effect of sintering temperature on the final Al/Cu bimetal properties. Three intermetallic compounds (IMCs) were detected (Al2Cu, Al4Cu9 and AlCu) between Al. and Cu. interface. Cracks were obtained for the specimens that were sintered at 600oC, lead to weaken and separation of the Al/Cu plates. The maximum strength for bonding was measured for the specimens that were sintered at 500oC. For the samples which sintered at 500oC, the lower electrical resistivity was detected where the good sintering was occurred for this specimen. | ||
| Keywords | ||
| Bimetal plate; powder metallurgy; intermetallic compound; bond strength; volume shrinkage | ||
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