Influence of Small Amount of Cu Addition on Microstructure, Deformation Temperature, and the Tensile Behaviour of Sn-9Zn-1.5Ag Lead free Solder Alloy | ||
| Egyptian Journal of Solids | ||
| Article 7, Volume 42, Issue 1 - Serial Number 42, 2020, Pages 83-95 PDF (1.13 M) | ||
| Document Type: Original Article | ||
| DOI: 10.21608/ejs.2020.148115 | ||
| Abstract | ||
| Sn-9Zn-1.5Ag and Sn-9Zn-1.5Ag-0.7Cu alloys have been inspected under different five strain rates ranging from 5.4x10-5 S-1 to 2.9x10-3 S-1 and different three temperatures extended from R.T. (298K) to 393 K for two alloys. The difference in thermal action, microstructure and stress-strain advantage related with addition of 0.7 Cu wt% was investigated. Transmission electronic microscope (TEM) investigation of samples revealed a homogenous uniform distribution, size refinement of IMCs and β-Sn grains. Addition of 0.7Cu particles into the Sn-9Zn-1.5Ag enhanced the yield stress σYS by 17% and reducing the ultimate tensile strength UTS by 12%. The addition of adding Cu was found to be lowering ductility (total elongation) by 19% of the Sn-9Zn-1.5Ag solder due to the refinement of β-Sn grains; this means that Sn-9Zn-1.5Ag-0.7Cu is more strengthening than Sn-9Zn-1.5Ag. The activation energy of Sn-9Zn-1.5Ag is lower than that of Sn-9Zn-1.5Ag-0.7Cu; therefore first sample is more superplastic. | ||
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