HEAT TRANSFER CHARACTERISTICS OF WATER FLOWING THROUGH SINGLE AND DOUBLE STACK RECTANGULAR MICROCHANNELS | ||
| The International Conference on Applied Mechanics and Mechanical Engineering | ||
| Article 48, Volume 16, 16th International Conference on Applied Mechanics and Mechanical Engineering., May 2014, Pages 1-16 PDF (2.4 M) | ||
| Document Type: Original Article | ||
| DOI: 10.21608/amme.2014.35600 | ||
| Authors | ||
| I. Elbadawy1; S. Anbr2; M. Fatouh3 | ||
| 1Assistant Professor, Department of Mechanical Power Engineering, Faculty of Engineering at El-Mattaria, Helwan University, Masaken El-Helmia P.O., Cairo 11718, Egypt. | ||
| 2Post Graduate student, Department of Mechanical Power Engineering, Faculty of Engineering at El-Mattaria, Helwan University, Masaken El-Helmia P.O., Cairo 11718, Egypt. | ||
| 3Professor, Department of Mechanical Power Engineering, Faculty of Engineering at El- Mattaria, Helwan University, Masaken El-Helmia P.O., Cairo 11718, Egypt. | ||
| Abstract | ||
| ABSTRACT The generated heat in electronic components whenever electric current flows through them causes their temperatures to rise. In order to minimize the temperature rise of the components, the dissipation of heat is necessary for their proper functioning. Copper based microchannel heat sinks have various advantages such as combine high material compatibility, high surface area per unit volume ratio and large potential heat transfer performance with highly sophisticated and economic fabrication process. Thus, the present work aimed at evaluating the heat transfer characteristics of water flowing through single and double stack rectangular microchannels of different aspect ratios in electronic cooling applications under different channel height, channel width and bottom wall thickness by uniform heat flux q = 100 W/cm2 and Re= 800. A three-dimensional computational fluid dynamics (CFD) model is built using the commercial package, ANSYS 14.0, to investigate the heat transfer characteristics of water flowing in single and double stack rectangular microchannels heat sink. Results are validated against experimental data obtained by Qu and Mudawar [1] at uniform heat flux, q = 100 W/cm2 and Re= 1454. Nearly uniform temperature profile and low temperature gradient are achieved in counter flow. | ||
| Keywords | ||
| heat transfer; Microchannels; Heat sink; Numerical study | ||
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