W., T., P., M. (2008). RELIABILITY OF MICROELECTRONIC DEVICES FROM EMITTERBASE JUNCTION CHARACTERIZATION. test, 13(13th International Conference on Applied Mechanics and Mechanical Engineering.), 29-37. doi: 10.21608/amme.2008.39820
TAZBIT W.; MIALHE P.. "RELIABILITY OF MICROELECTRONIC DEVICES FROM EMITTERBASE JUNCTION CHARACTERIZATION". test, 13, 13th International Conference on Applied Mechanics and Mechanical Engineering., 2008, 29-37. doi: 10.21608/amme.2008.39820
W., T., P., M. (2008). 'RELIABILITY OF MICROELECTRONIC DEVICES FROM EMITTERBASE JUNCTION CHARACTERIZATION', test, 13(13th International Conference on Applied Mechanics and Mechanical Engineering.), pp. 29-37. doi: 10.21608/amme.2008.39820
W., T., P., M. RELIABILITY OF MICROELECTRONIC DEVICES FROM EMITTERBASE JUNCTION CHARACTERIZATION. test, 2008; 13(13th International Conference on Applied Mechanics and Mechanical Engineering.): 29-37. doi: 10.21608/amme.2008.39820